Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/4209
Title: Investigation of low temperature wafer bonding using intermediate layer
Authors: Deng, Shusheng
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
Issue Date: 2004
Abstract: In this project, the sol-gel intermediate layer bonding is demonstrated to provide high bond strength at low temperature (such as 100 degree celsius).
URI: http://hdl.handle.net/10356/4209
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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