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dc.contributor.authorLoo, Shin Yi.-
dc.description.abstractThis report shall give an account of my work and the experiences gained during my internship with the Siemens Medical Instruments Pte. Ltd. (SMI) from 5 January 2009 to 5 June 2009. The first part of the report will give an overview about SMI and hearing instrument standards. Some common hearing instrument terms will also be discussed in this section followed by the description of the hearing instruments measurements performed in SMI. The main part of the report will discuss about the progress of the four projects involved and the task completed. The main focus of my work is the supporting of Pendo project, where I learnt about the Product Lifecycle Management of a hearing aid project from conceptual to product release. The project also allows me to experiment with the ferrite beads to suppress Electromagnetic Interference (EMI) and expose to the reliability tests conducted in all manufacturing companies. I am also heavily involved in the Active Telecoil bonus project where investigation into cost-effective in-house built of active telecoil without compromising of performance is done. This is the project where I could better relate my electronics knowledge learnt from the University to the project.en_US
dc.format.extent154 p.en_US
dc.rightsNanyang Technological University-
dc.subjectDRNTU::Engineering::Electrical and electronic engineeringen_US
dc.titleReport on industrial attachment with Siemens Medical Instruments Pte Ltden_US
dc.typeIndustrial Attachment (IA)en_US
dc.contributor.supervisorShum Pingen_US
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.contributor.organizationSiemens Medical Instruments Pte. Ltd.en_US
dc.contributor.supervisor2Sam Lit Minen_US
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Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)
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