Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/42539
Title: Development of novel ceramic composites for heat management of advanced electronic devices
Authors: Zhang, Wei Da
Keywords: DRNTU::Engineering::Materials::Composite materials
Issue Date: 1999
Abstract: Advanced photolithography (stepper technology) and multilayer technology have brought the semiconductor industry into a real very-large-scale integration (VLSI) era. The technologies have made it possible for millions of electronic elements to be integrated in a very small chip. The integration is expected to reach billions soon. One major aspect of an individual electronic transistor or other elements in the VLSI circuits is that it has a very small size and consumes a very little power so that it can attain very high speed of operation. It also consumes little power.
URI: http://hdl.handle.net/10356/42539
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:SAS Theses

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