Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/42539
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dc.contributor.authorZhang, Wei Da
dc.date.accessioned2010-12-30T03:42:40Z
dc.date.available2010-12-30T03:42:40Z
dc.date.copyright1999en_US
dc.date.issued1999
dc.identifier.urihttp://hdl.handle.net/10356/42539
dc.description.abstractAdvanced photolithography (stepper technology) and multilayer technology have brought the semiconductor industry into a real very-large-scale integration (VLSI) era. The technologies have made it possible for millions of electronic elements to be integrated in a very small chip. The integration is expected to reach billions soon. One major aspect of an individual electronic transistor or other elements in the VLSI circuits is that it has a very small size and consumes a very little power so that it can attain very high speed of operation. It also consumes little power.en_US
dc.format.extent147 p.en_US
dc.language.isoenen_US
dc.subjectDRNTU::Engineering::Materials::Composite materialsen_US
dc.titleDevelopment of novel ceramic composites for heat management of advanced electronic devicesen_US
dc.typeThesis
dc.contributor.supervisorPeter Hing
dc.contributor.schoolSchool of Applied Scienceen_US
dc.description.degreeMaster of Applied Scienceen_US
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