Development of novel ceramic composites for heat management of advanced electronic devices

Abstract

Advanced photolithography (stepper technology) and multilayer technology have brought the semiconductor industry into a real very-large-scale integration (VLSI) era. The technologies have made it possible for millions of electronic elements to be integrated in a very small chip. The integration is expected to reach billions soon. One major aspect of an individual electronic transistor or other elements in the VLSI circuits is that it has a very small size and consumes a very little power so that it can attain very high speed of operation. It also consumes little power.