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|Title:||Development of novel ceramic composites for heat management of advanced electronic devices||Authors:||Zhang, Wei Da||Keywords:||DRNTU::Engineering::Materials::Composite materials||Issue Date:||1999||Abstract:||Advanced photolithography (stepper technology) and multilayer technology have brought the semiconductor industry into a real very-large-scale integration (VLSI) era. The technologies have made it possible for millions of electronic elements to be integrated in a very small chip. The integration is expected to reach billions soon. One major aspect of an individual electronic transistor or other elements in the VLSI circuits is that it has a very small size and consumes a very little power so that it can attain very high speed of operation. It also consumes little power.||URI:||http://hdl.handle.net/10356/42539||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||SAS Theses|
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