Please use this identifier to cite or link to this item:
Title: Development of novel ceramic composites for heat management of advanced electronic devices
Authors: Zhang, Wei Da
Keywords: DRNTU::Engineering::Materials::Composite materials
Issue Date: 1999
Abstract: Advanced photolithography (stepper technology) and multilayer technology have brought the semiconductor industry into a real very-large-scale integration (VLSI) era. The technologies have made it possible for millions of electronic elements to be integrated in a very small chip. The integration is expected to reach billions soon. One major aspect of an individual electronic transistor or other elements in the VLSI circuits is that it has a very small size and consumes a very little power so that it can attain very high speed of operation. It also consumes little power.
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:SAS Theses

Files in This Item:
File Description SizeFormat 
  Restricted Access
18.18 MBAdobe PDFView/Open

Google ScholarTM


Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.