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|Title:||Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line||Authors:||Joseph Erasmo A. Galang||Keywords:||DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging||Issue Date:||2003||Abstract:||This thesis is an example of how we can adopt a strategy to be cost competent in launching new Integrated Circuit (IC) packages in the market. On e is in an environment wherein the cost of manufacturing is far above and beyond many South East – Asian coutries especially in terms of manpower, material or cost of producing the product.||URI:||http://hdl.handle.net/10356/4262||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||EEE Theses|
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