Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/4262
Title: Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line
Authors: Joseph Erasmo A. Galang
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Issue Date: 2003
Abstract: This thesis is an example of how we can adopt a strategy to be cost competent in launching new Integrated Circuit (IC) packages in the market. On e is in an environment wherein the cost of manufacturing is far above and beyond many South East – Asian coutries especially in terms of manpower, material or cost of producing the product.
URI: http://hdl.handle.net/10356/4262
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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