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DC Field | Value | Language |
---|---|---|
dc.contributor.author | Joseph Erasmo A. Galang | en_US |
dc.date.accessioned | 2008-09-17T09:47:56Z | |
dc.date.available | 2008-09-17T09:47:56Z | |
dc.date.copyright | 2003 | en_US |
dc.date.issued | 2003 | |
dc.identifier.uri | http://hdl.handle.net/10356/4262 | |
dc.description.abstract | This thesis is an example of how we can adopt a strategy to be cost competent in launching new Integrated Circuit (IC) packages in the market. On e is in an environment wherein the cost of manufacturing is far above and beyond many South East – Asian coutries especially in terms of manpower, material or cost of producing the product. | en_US |
dc.rights | Nanyang Technological University | en_US |
dc.subject | DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging | |
dc.title | Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line | en_US |
dc.type | Thesis | en_US |
dc.contributor.supervisor | Ho, Yeong Khing | en_US |
dc.contributor.school | School of Electrical and Electronic Engineering | en_US |
dc.description.degree | Master of Science (Computer Control and Automation) | en_US |
item.fulltext | With Fulltext | - |
item.grantfulltext | restricted | - |
Appears in Collections: | EEE Theses |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
EEE-THESES_314.pdf Restricted Access | 5.61 MB | Adobe PDF | View/Open |
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