Please use this identifier to cite or link to this item:
Title: Simulation and characterization of the inductive-coupled plasma chemical vapour deposition of nano-sized materials
Authors: Asutosh Srivastava.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Nanoelectronics
Issue Date: 2004
Abstract: The details of Inductively Coupled Plasma and Chemical Vapor Deposition and their integration is given. The details of PIC simulation are discussed. The results of characterization of the films formed making use of the optimum parameters is also discussed.
Schools: School of Electrical and Electronic Engineering 
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

Files in This Item:
File Description SizeFormat 
  Restricted Access
1.97 MBAdobe PDFView/Open

Page view(s) 50

Updated on Jun 22, 2024


Updated on Jun 22, 2024

Google ScholarTM


Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.