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Title: Electrical characterization of IC packages
Authors: Guruprasad B. G.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Issue Date: 2003
Abstract: In this project, a PBGA package 3D lumped element model is developed and its parasitics are extracted using a FEM based solver. The package data is validated with a standard measurement procedure developed by JEDEC. This simulation methodology can be extended to other critical signals and packages, and the parasitics can be extracted.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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