Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/44032
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dc.contributor.authorAw, Jie Li
dc.date.accessioned2011-05-19T07:26:19Z
dc.date.available2011-05-19T07:26:19Z
dc.date.copyright2011en_US
dc.date.issued2011
dc.identifier.urihttp://hdl.handle.net/10356/44032
dc.description.abstractInterests in low temperature “green” solder has been increasing with the complexity of electronics. The low processing temperature meant lower damage to the active layers, which in turn promises better reliability. However, with an increasingly wide range of applications for electronics, comes a different set of problems for each application. The optimized solution is customization, but existing traditional means of research is too arduous and slow. Hence to reduce time in this search for a suitable solder, combinatorial methodology is adapted to accelerate the speed of research. Indium-based alloys have been documented to have low melting points, and through the adapted combinatorial methodology, the electrical characteristics of the different compositions are explored. This project concludes that the morphological properties affect the resistivity of deposited solder as it approaches thinner dimensions. Morphology‟s effects should be understood clearly to create a reliable model that can be used to effectively discount the morphological effects on resistivity, or another testing structure could be developed that would be morphological independent, yet allowing the ease of testing.en_US
dc.format.extent47 p.en_US
dc.language.isoenen_US
dc.rightsNanyang Technological University
dc.subjectDRNTU::Engineering::Materials::Electronic packaging materialsen_US
dc.titleElectrical characterization of indium-tin based solder materialsen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorGan Chee Lipen_US
dc.contributor.schoolSchool of Materials Science and Engineeringen_US
dc.description.degreeBachelor of Engineering (Materials Engineering)en_US
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Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)
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