Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/44032
Title: Electrical characterization of indium-tin based solder materials
Authors: Aw, Jie Li
Keywords: DRNTU::Engineering::Materials::Electronic packaging materials
Issue Date: 2011
Abstract: Interests in low temperature “green” solder has been increasing with the complexity of electronics. The low processing temperature meant lower damage to the active layers, which in turn promises better reliability. However, with an increasingly wide range of applications for electronics, comes a different set of problems for each application. The optimized solution is customization, but existing traditional means of research is too arduous and slow. Hence to reduce time in this search for a suitable solder, combinatorial methodology is adapted to accelerate the speed of research. Indium-based alloys have been documented to have low melting points, and through the adapted combinatorial methodology, the electrical characteristics of the different compositions are explored. This project concludes that the morphological properties affect the resistivity of deposited solder as it approaches thinner dimensions. Morphology‟s effects should be understood clearly to create a reliable model that can be used to effectively discount the morphological effects on resistivity, or another testing structure could be developed that would be morphological independent, yet allowing the ease of testing.
URI: http://hdl.handle.net/10356/44032
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)

Files in This Item:
File Description SizeFormat 
mse10-150.pdf
  Restricted Access
3.26 MBAdobe PDFView/Open

Page view(s) 20

422
Updated on Nov 26, 2020

Download(s) 5

8
Updated on Nov 26, 2020

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.