Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/4432
Title: Texture and stress study of barrier layers on various low-K materials in copper technology
Authors: Jia, Guojun
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Issue Date: 2004
Abstract: The texture and stress properties of barrier layers on three types of low-k materials for copper (Cu) interconnects and electrical performance of the structure had been investigated.
URI: http://hdl.handle.net/10356/4432
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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