Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/44638
Title: Bonding of microfluidic devices
Authors: Ng, Teck Chun.
Keywords: DRNTU::Engineering::Mechanical engineering
Issue Date: 2011
Abstract: A study on the characteristics of ultrasonic bonding of micro-injection molded parts and its implication on the part’s structure integrity was conducted. One-factor-at-a-time method was utilized to study the effects of varying trigger pressure, amplitude and weld time on parts molded from Cyclic Olefin Copolymer (COC) and Poly (Methyl Methacrylate) Acrylic (PMMA) resin. Setting for acceptable weld appearance was obtained. However, no combination of parameters was found to result in proper flow on the micro fluidic channels due to the gaps contributed by the un-fused energy directors. Hot plate welding was employed at the later stage of the project as a solution to minimize the gaps that were form by the un-fused energy directors. Setting for acceptable weld appearance was obtained. However, no combination of parameters was found to result in proper flow on the micro fluidic channels due to the high pressure distribution gradient on the plate. Finally, recommendations were made for possible future work and other improvements that could be made to the bonding process of micro fluidic devices.
URI: http://hdl.handle.net/10356/44638
Schools: School of Mechanical and Aerospace Engineering 
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)

Files in This Item:
File Description SizeFormat 
mB129.pdf
  Restricted Access
3.06 MBAdobe PDFView/Open

Page view(s) 50

540
Updated on Jun 22, 2024

Download(s)

15
Updated on Jun 22, 2024

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.