Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/44924
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dc.contributor.authorTan, Hua Wei.-
dc.date.accessioned2011-06-07T02:57:51Z-
dc.date.available2011-06-07T02:57:51Z-
dc.date.copyright2011en_US
dc.date.issued2011-
dc.identifier.urihttp://hdl.handle.net/10356/44924-
dc.description.abstractUltrasonic inspection also known as Ultrasonic Testing (UT) has been in practiced for flaw detection, dimensional measurements, material characterization on various materials. It has been used in various industries to provide a fast, accurate and non-harmful way of examinations and measurements. This report describes the design of a compact ultrasonic detector system for pipe flaw inspection. The process firstly due with simulation of ultrasound in pipe-shape material which provides significant information for choosing the right transducer needed. Secondly, design and fabrication of compact ultrasonic detector system (Ultrasound pulse generator and Ultrasound receiver) to provide capabilities for driving and receiving signal to/from the transducer and lastly programming of FPGA to control over the circuitry. The project has been successful in finding out the limitation of ultrasound simulation, provided initial circuitries which have the potential of driving and receiving signal to/from the ultrasound transducer and developed programs that are capable of controlling the circuitries.en_US
dc.format.extent89 p.en_US
dc.language.isoenen_US
dc.rightsNanyang Technological University-
dc.subjectDRNTU::Engineering::Electrical and electronic engineering::Electronic circuitsen_US
dc.titleDesign of compact ultrasonic detector system for pipe flaw inspectionen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.description.degreeBachelor of Engineeringen_US
dc.contributor.supervisor2Chen Shoushunen_US
dc.contributor.supervisor2Tan Cher Mingen_US
item.grantfulltextrestricted-
item.fulltextWith Fulltext-
Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)
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