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|Title:||Optimization of hot embossing parameters in the microfabrication of COC microfluidic device||Authors:||Woo, Edmund Zhi De.||Keywords:||DRNTU::Engineering::Mechanical engineering::Fluid mechanics||Issue Date:||2011||Abstract:||Since the commercialization of microtechnology, low cost production together with reliable and efficient fabrication techniques has become the top deciding factors among manufacturers. The effectiveness of hot embossing micro features onto polymer substrate has been proven by past research. However, the replication quality differs with varying key process parameters such as embossing temperature, pressure (load) and holding time. Hence, the next challenge is to develop a systematic way of optimizing the process parameters with a goal of obtaining consistently good replication quality. The purpose of the project is to investigate the effects and optimize the 3 key hot embossing parameters. The Design of Experiments (DOE), particularly 2k experiment is used to screen the effects of these parameters while the optimization method (where further experiments are carried out) to obtain the minimum demolding energy with good replication channel quality. Excessive demolding energy is undesirable because it means that the specimen is subjected to large thermal stresses which may hamper good channel definition.||URI:||http://hdl.handle.net/10356/45259||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MAE Student Reports (FYP/IA/PA/PI)|
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