Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/45259
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dc.contributor.authorWoo, Edmund Zhi De.
dc.date.accessioned2011-06-10T04:56:55Z
dc.date.available2011-06-10T04:56:55Z
dc.date.copyright2011en_US
dc.date.issued2011
dc.identifier.urihttp://hdl.handle.net/10356/45259
dc.description.abstractSince the commercialization of microtechnology, low cost production together with reliable and efficient fabrication techniques has become the top deciding factors among manufacturers. The effectiveness of hot embossing micro features onto polymer substrate has been proven by past research. However, the replication quality differs with varying key process parameters such as embossing temperature, pressure (load) and holding time. Hence, the next challenge is to develop a systematic way of optimizing the process parameters with a goal of obtaining consistently good replication quality. The purpose of the project is to investigate the effects and optimize the 3 key hot embossing parameters. The Design of Experiments (DOE), particularly 2k experiment is used to screen the effects of these parameters while the optimization method (where further experiments are carried out) to obtain the minimum demolding energy with good replication channel quality. Excessive demolding energy is undesirable because it means that the specimen is subjected to large thermal stresses which may hamper good channel definition.en_US
dc.format.extent98 p.en_US
dc.language.isoenen_US
dc.rightsNanyang Technological University
dc.subjectDRNTU::Engineering::Mechanical engineering::Fluid mechanicsen_US
dc.titleOptimization of hot embossing parameters in the microfabrication of COC microfluidic deviceen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorYue Chee Yoonen_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.description.degreeBachelor of Engineering (Mechanical Engineering)en_US
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Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)
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