Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/45453
Title: PCM cooling of mobile devices
Authors: Shepherdson Tabitha Maria.
Keywords: DRNTU::Engineering::Mechanical engineering::Energy conservation
Issue Date: 2011
Abstract: The ever-evolving landscape of technology has led to an influx of mobile gadgets catered to the discerning consumer. Tablet computers need to offer better processing capabilities whilst decreasing in size. Shrinking devices emphasizes the need for proper cooling methods to prevent overheating and damaging internal components. This report concerns the effectiveness of using phase change materials (PCM) in cooling a mobile device, namely the tablet computer. A mock tablet computer was constructed comprising an acrylic casing enclosing the aluminium heat sink. This heat sink contained 6 rectangular cavities filled with the PCM, n-eicosane. The heater that simulated a computer chip was connected to the heat sink via copper bars or miniature heat pipes, the number of which could be varied.
URI: http://hdl.handle.net/10356/45453
Schools: School of Mechanical and Aerospace Engineering 
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)

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