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Title: Computer simulation of electric field level for design of high-voltage systems
Authors: Ang, Daniel Chin Chye
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electric power
Issue Date: 2011
Abstract: A good modern power system would have to be both reliable and robust. One aspect to designing a good power system involves an in-depth study of the electric field stress in power apparatuses. With modern day technology and the advancement of the computer, we are able to use programs to help us study and control the electric field in apparatus design. For the main part of the project, computer simulation software is used to simulate various physical design problems to achieve optimization of the electric field or meaningful conclusion. Maxwell 2D was first used to familiarize with the software and to work on simple design and generate the electric field. Maxwell 3D is used in the 2nd part to increase the accuracy of the simulation as it allows for a three dimensional view and design of the physical object so as to mimic real life situations. This project starts with a discussion on Finite Element Methods, to familiarize with the numerical methods which are the foundation of electric field computation. Different case studies are subsequently conducted. Firstly is the study on the permittivity of insulation material. In the second case, field stress in cylindrical and graded bushing are simulated and compared. This is followed by a short study on the micro roughness effects on electric field induced by modeling micro-spikes onto one of the surface of a parallel electrode plane. Next is a classic case of the rod-plane gap study to design the perfect contour cap. Lastly, a void is modeled and simulation in the dielectric material to understand the impact on electric field magnitude in the void.
Schools: School of Electrical and Electronic Engineering 
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)

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