Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/46197
Title: Automated detection of cracks in solder joints using X-ray imaging
Authors: Wang, Zenan.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation
Issue Date: 2011
Abstract: This paper introduces a new method of crack detection by analyzing the slice images extract from X-ray computed tomography generated 3-D structure image. Random positioned 3-D component image is rotated by certain calculated angle in order to obtain a suitable alignment for image extraction. Extracted images are further processed to provide the characteristics, mainly relating the crack site, of the image. The crack detection can be achieved by area comparison of different soldiering bases.
URI: http://hdl.handle.net/10356/46197
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)

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