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https://hdl.handle.net/10356/46197| Title: | Automated detection of cracks in solder joints using X-ray imaging | Authors: | Wang, Zenan. | Keywords: | DRNTU::Engineering::Electrical and electronic engineering::Control and instrumentation | Issue Date: | 2011 | Abstract: | This paper introduces a new method of crack detection by analyzing the slice images extract from X-ray computed tomography generated 3-D structure image. Random positioned 3-D component image is rotated by certain calculated angle in order to obtain a suitable alignment for image extraction. Extracted images are further processed to provide the characteristics, mainly relating the crack site, of the image. The crack detection can be achieved by area comparison of different soldiering bases. | URI: | http://hdl.handle.net/10356/46197 | Schools: | School of Electrical and Electronic Engineering | Organisations: | A*STAR SIMTech | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | EEE Student Reports (FYP/IA/PA/PI) |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| EB4080.pdf Restricted Access | 1.84 MB | Adobe PDF | View/Open |
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