Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/46197
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dc.contributor.authorWang, Zenan.
dc.date.accessioned2011-07-04T07:07:37Z
dc.date.available2011-07-04T07:07:37Z
dc.date.copyright2011en_US
dc.date.issued2011
dc.identifier.urihttp://hdl.handle.net/10356/46197
dc.description.abstractThis paper introduces a new method of crack detection by analyzing the slice images extract from X-ray computed tomography generated 3-D structure image. Random positioned 3-D component image is rotated by certain calculated angle in order to obtain a suitable alignment for image extraction. Extracted images are further processed to provide the characteristics, mainly relating the crack site, of the image. The crack detection can be achieved by area comparison of different soldiering bases.en_US
dc.format.extent81 p.en_US
dc.language.isoenen_US
dc.rightsNanyang Technological University
dc.subjectDRNTU::Engineering::Electrical and electronic engineering::Control and instrumentationen_US
dc.titleAutomated detection of cracks in solder joints using X-ray imagingen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorPonnuthurai Nagaratnam Suganthanen_US
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.description.degreeBachelor of Engineeringen_US
dc.contributor.organizationA*STAR SIMTechen_US
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Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)
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