Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/46379
Title: Hot embossing of micro devices
Authors: Yang, Yong Lin
Keywords: DRNTU::Engineering::Mechanical engineering
Issue Date: 2011
Abstract: In today industrial, Micro-Electro-Mechanical Systems (MEMS) technology is commonly used. For commercialization of this technology, the 2 main criteria are low cost fabrication and also high volume production. Due to these 2 reasons, in recent years, there is a shift of products from silicon based material to polymer based material. For the production of polymer based products, there is an increasing interest in hot embossing manufacturing process. In this project, a systematic way of optimizing the process parameters will be discussed. The polymeric substrate will be embossed with steel-machined mold insert and replication quality will be inspected using Scanning Electron Microscope.
URI: http://hdl.handle.net/10356/46379
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)

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