Please use this identifier to cite or link to this item:
https://hdl.handle.net/10356/46635| Title: | NDT of adhesively bonded structure based on the impedance method | Authors: | Lim, Mong King Liew, Kim Meow Low, Seow Chay Wong, Brian Stephen Jiang Li Tui, Chen Guan |
Keywords: | DRNTU::Engineering::Aeronautical engineering | Issue Date: | 1994 | Abstract: | The use of the mechanical impedance method for non-destructive testing and analysis of honeycomb structures is described in this study. Mechanical impedance instruments, MIA 3000, Versiscan and VP 200, were used to study the detachment of honeycomb structures on specimens which were made of two layers of thin aluminium skins with Nomex honeycomb cores. | Description: | 171 p. | URI: | http://hdl.handle.net/10356/46635 | Schools: | School of Mechanical and Production Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MAE Research Reports (Staff & Graduate Students) |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| MAE_RESEARCH_REPORTS_20.pdf Restricted Access | 19.2 MB | Adobe PDF | View/Open |
Page view(s) 50
572
Updated on Mar 16, 2025
Download(s)
16
Updated on Mar 16, 2025
Google ScholarTM
Check
Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.