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Title: NDT of adhesively bonded structure based on the impedance method
Authors: Lim, Mong King
Liew, Kim Meow
Low, Seow Chay
Wong, Brian Stephen
Jiang Li
Tui, Chen Guan
Keywords: DRNTU::Engineering::Aeronautical engineering
Issue Date: 1994
Abstract: The use of the mechanical impedance method for non-destructive testing and analysis of honeycomb structures is described in this study. Mechanical impedance instruments, MIA 3000, Versiscan and VP 200, were used to study the detachment of honeycomb structures on specimens which were made of two layers of thin aluminium skins with Nomex honeycomb cores.
Description: 171 p.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Research Reports (Staff & Graduate Students)

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