Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/46809
Title: Interface characterization of wafer bonding
Authors: Sun, Lina.
Keywords: DRNTU::Engineering::Electrical and electronic engineering
Issue Date: 2009
Source: Sun, L. (2009). Interface characterization of wafer bonding. Master’s thesis, Nanyang Technological University, Singapore.
Abstract: Wafer bonding technology presents one way of fabricating power diode devices directly rather than in a semiconductor bulk. It provides an effective way with great potential for the power diode mass production. However, for practical applications of wafer bonding technique, it is important to determine the optimized process conditions to achieve good electrical performance.
Description: 189 p.
URI: http://hdl.handle.net/10356/46809
Rights: Nanyang Technological University
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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