Interface characterization of wafer bonding
Date of Issue2009
School of Electrical and Electronic Engineering
Wafer bonding technology presents one way of fabricating power diode devices directly rather than in a semiconductor bulk. It provides an effective way with great potential for the power diode mass production. However, for practical applications of wafer bonding technique, it is important to determine the optimized process conditions to achieve good electrical performance.
DRNTU::Engineering::Electrical and electronic engineering
Nanyang Technological University