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|Title:||Interface characterization of wafer bonding||Authors:||Sun, Lina||Keywords:||DRNTU::Engineering::Electrical and electronic engineering||Issue Date:||2009||Source:||Sun, L. (2009). Interface characterization of wafer bonding. Master’s thesis, Nanyang Technological University, Singapore.||Abstract:||Wafer bonding technology presents one way of fabricating power diode devices directly rather than in a semiconductor bulk. It provides an effective way with great potential for the power diode mass production. However, for practical applications of wafer bonding technique, it is important to determine the optimized process conditions to achieve good electrical performance.||Description:||189 p.||URI:||https://hdl.handle.net/10356/46809||DOI:||10.32657/10356/46809||Rights:||Nanyang Technological University||Fulltext Permission:||open||Fulltext Availability:||With Fulltext|
|Appears in Collections:||EEE Theses|
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