Chip-package codesign of 5 GHz RF receiver front end.
Wang, Jun Jun.
Date of Issue2006
School of Electrical and Electronic Engineering
Nowadays, the demand for smaller and lighter portable electronics is driving both the semiconductor and packaging industries to increase integration density for radio frequency (RF) transceivers. Chip-package codesign opens a new era for integration, as the package is now part of the circuit. However, there are many problems to be solved for chip-package codesign.
DRNTU::Engineering::Electrical and electronic engineering::Antennas, wave guides, microwaves, radar, radio
Nanyang Technological University