Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/46949
Title: Chip-package codesign of 5 GHz RF receiver front end
Authors: Wang, Junjun
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Antennas, wave guides, microwaves, radar, radio
Issue Date: 2006
Source: Wang, J. J. (2006). Chip-package codesign of 5 GHz RF receiver front end. Doctoral thesis, Nanyang Technological University, Singapore.
Abstract: Nowadays, the demand for smaller and lighter portable electronics is driving both the semiconductor and packaging industries to increase integration density for radio frequency (RF) transceivers. Chip-package codesign opens a new era for integration, as the package is now part of the circuit. However, there are many problems to be solved for chip-package codesign.
Description: 170 p.
URI: https://hdl.handle.net/10356/46949
DOI: 10.32657/10356/46949
Rights: Nanyang Technological University
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

Files in This Item:
File Description SizeFormat 
EEE_THESES_280.pdf17.35 MBAdobe PDFThumbnail
View/Open

Page view(s) 20

221
Updated on Feb 27, 2021

Download(s) 20

157
Updated on Feb 27, 2021

Google ScholarTM

Check

Altmetric


Plumx

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.