Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/4699
Title: High frequency measurement of dielectric properties for packaging materials
Authors: Lim, Ying Ying
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Issue Date: 2005
Source: Lim, Y. Y. (2005). High frequency measurement of dielectric properties for packaging materials. Master’s thesis, Nanyang Technological University, Singapore.
Abstract: This thesis summarizes the purpose and milestones covered in the process of carrying out the project. Essentially, the project proposes to develop and implement a suitable method to measure the complex permittivity of thin (l-3mm) packaging materials used in the microelectronics industry. Apart from being able to measure over a large bandwidth from 0.1 -20 GHz and be relatively low cost and easy to implement, the technique also has to be reasonably accurate as compared to other available methods.
URI: https://hdl.handle.net/10356/4699
DOI: 10.32657/10356/4699
Rights: Nanyang Technological University
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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