Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/4699
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dc.contributor.authorLim, Ying Yingen
dc.date.accessioned2008-09-17T09:56:54Zen
dc.date.available2008-09-17T09:56:54Zen
dc.date.copyright2005en
dc.date.issued2005en
dc.identifier.citationLim, Y. Y. (2005). High frequency measurement of dielectric properties for packaging materials. Master’s thesis, Nanyang Technological University, Singapore.en
dc.identifier.urihttps://hdl.handle.net/10356/4699en
dc.description.abstractThis thesis summarizes the purpose and milestones covered in the process of carrying out the project. Essentially, the project proposes to develop and implement a suitable method to measure the complex permittivity of thin (l-3mm) packaging materials used in the microelectronics industry. Apart from being able to measure over a large bandwidth from 0.1 -20 GHz and be relatively low cost and easy to implement, the technique also has to be reasonably accurate as compared to other available methods.en
dc.rightsNanyang Technological Universityen
dc.subjectDRNTU::Engineering::Electrical and electronic engineering::Electronic packagingen
dc.titleHigh frequency measurement of dielectric properties for packaging materialsen
dc.typeThesisen
dc.contributor.supervisorMihai Dragos Rotaruen
dc.contributor.supervisorArokiaswami Alphonesen
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen
dc.description.degreeMASTER OF ENGINEERING (EEE)en
dc.identifier.doi10.32657/10356/4699en
item.grantfulltextopen-
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Appears in Collections:EEE Theses
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