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Title: Thermal stress and fatigue analysis of microelectronic packaging
Authors: Tan, Meng Leong.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Issue Date: 1998
Abstract: A programme written by Robert Darveaux was downloaded and run using ANSYS™ 5.3 in this project to develop better understanding of mechanical failures in electronic packaging and SMT solder joints caused by mismatch of coefficient of thermal expansions between the materials. Simulation of thermal cycles which modern encapsulated IC chips such as Plastic Ball Grid Array (PBGA) DRAM chips are expected to experience was imposed on to the finite element model and results obtained were studied and analysed.
Description: 62 p.
Schools: School of Mechanical and Production Engineering 
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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