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Title: Carbon nanotubes based interconnect technology
Authors: Devappa Shetty Kishan
Keywords: DRNTU::Engineering::Nanotechnology
Issue Date: 2006
Abstract: With ever-increasing demands to shrink the dimensions of microelectronic devices, interconnect scaling has made limited advances in high-performance integrated circuits. Interconnect resistance and capacitance (also known as RCproduct) has become important parameters in determining integrated circuit design, design rules, packing density, and device performance. Interconnect delays must be minimized due to ever increasing needs for faster devices with low power consumption.
Description: 85 p.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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