Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/47225
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dc.contributor.authorGovindan Radhakrishnan Kumaresh.en_US
dc.date.accessioned2011-12-27T06:37:29Z-
dc.date.available2011-12-27T06:37:29Z-
dc.date.copyright2010en_US
dc.date.issued2010-
dc.identifier.urihttp://hdl.handle.net/10356/47225-
dc.description159 p.en_US
dc.description.abstractThe heating effect produced during their operation of mobile phone is hazardous. Hence, cooling of mobile phones plays a vital role in the design phase. Phase change materials (PCMs) can be used for cooling purpose since latent heat storage in PCM has high energy storage density. The melting temperature of n-eicosane at 36°C can maintain the heat source at much lower than the allowable temperature until the PCM is fully melted. The required amount of PCM was stored inside the heat storage unit (HSU) which is located strategically inside the mobile phone. The heat pipe, which has high effective thermal conductivity, can be used inside the mobile phone to transfer the heat from various heat sources inside the mobile phone to the other end of the heat pipe where the HSU containing the PCM is located.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineeringen_US
dc.titleNumerical investigations of PCM-cooled mobile devicesen_US
dc.typeThesisen_US
dc.contributor.supervisorTan Fock Laien_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.description.degreeMaster of Science (Mechanical Engineering)en_US
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