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Title: Reliable and high speed RF MEMS switches with wafer-scale encapsulation
Authors: Ke, Feixiang
Keywords: DRNTU::Engineering::Mechanical engineering
Issue Date: 2009
Source: Ke, F. (2009). Reliable and high speed RF MEMS switches with wafer-scale encapsulation. Doctoral thesis, Nanyang Technological University, Singapore.
Abstract: The tremendously fast expansion of wireless and satellite communication systems in the information age is without parallel in history, leading to increase in the demand for miniaturized communication systems with smaller sizes, lighter weights, better functionalities and higher reliabilities. RF MEMS are widely recognized as enabling technologies for the miniaturization due to their promising characteristics of broadband operation, low power consumption and insertion loss, high isolation, and excellent signal linearity. In the past decade, RF MEMS switches are receiving much more attention for communication systems including tuneable matching networks, phase shifters, resonators, and reconfigurable filters. Nevertheless, challenges remain for the RF switches, restricting their applications in many systems. Reliability, packaging, switching speed, and power handling are among the common challenges shared by MEMS switches.
Description: 181 p.
DOI: 10.32657/10356/47243
Schools: School of Mechanical and Aerospace Engineering 
Rights: Nanyang Technological University
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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