dc.contributor.authorChew, Effie Yeong Hueyen_US
dc.date.accessioned2011-12-27T06:54:43Z
dc.date.accessioned2017-07-23T08:37:19Z
dc.date.available2011-12-27T06:54:43Z
dc.date.available2017-07-23T08:37:19Z
dc.date.copyright2009en_US
dc.date.issued2009
dc.identifier.citationChew, E. Y. H. (2009). Micro-doping in ultrafine-grained gold bonding wires. Doctoral thesis, Nanyang Technological University, Singapore.
dc.identifier.urihttp://hdl.handle.net/10356/47295
dc.description227 p.en_US
dc.description.abstractWire bonding remains the dominant form of interconnection technology, and is expected to be used in 85% of total IC units worldwide by 2010. As device miniaturization continues, the diameters of wires get finer, requiring higher mechanical strength from the thin wires for handling. However, strong wires with low ductility pose an insurmountable hurdle in manufacturing because of formability issues. Therefore, strategies to attain both high strength and ductility (dual improvement) in Au wires need to be developed, a goal shared by researchers in the field of nanocrystalline (NC) and ultrafine-grained (UFG) materials.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Materialsen_US
dc.titleMicro-doping in ultrafine-grained gold bonding wiresen_US
dc.typeThesisen_US
dc.contributor.schoolSchool of Materials Science and Engineeringen_US
dc.contributor.supervisorWong Chee Cheongen_US
dc.description.degreeDOCTOR OF PHILOSOPHY (MSE)en_US


Files in this item

FilesSizeFormatView
MSE_THESES_3.pdf24.84Mbapplication/pdfView/Open

This item appears in the following Collection(s)

Show simple item record