Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/4733
Title: Electroless copper plating for ULSI applications
Authors: Liu, Kaiyu.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials
Issue Date: 2001
Abstract: This thesis presents the electroless copper deposition process and characterization of the deposited copper films. The electroless deposition parameters were optimized by evaluating the influence of chemical compositions, processing temperature and pH value.
URI: http://hdl.handle.net/10356/4733
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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