Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/4794
Title: Study of copper diffusion in tantalum based barrier materials
Authors: Loh, Seow Wee.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials
Issue Date: 2004
Abstract: This thesis presents our findings on Cu diffusion into different potential barrier layers.
URI: http://hdl.handle.net/10356/4794
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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