Please use this identifier to cite or link to this item:
https://hdl.handle.net/10356/4794| Title: | Study of copper diffusion in tantalum based barrier materials | Authors: | Loh, Seow Wee. | Keywords: | DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials | Issue Date: | 2004 | Abstract: | This thesis presents our findings on Cu diffusion into different potential barrier layers. | URI: | http://hdl.handle.net/10356/4794 | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | EEE Theses |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| EEE-THESES_793.pdf Restricted Access | 3.13 MB | Adobe PDF | View/Open |
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