Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/4794
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dc.contributor.authorLoh, Seow Wee.en_US
dc.date.accessioned2008-09-17T09:58:49Z-
dc.date.available2008-09-17T09:58:49Z-
dc.date.copyright2004en_US
dc.date.issued2004-
dc.identifier.urihttp://hdl.handle.net/10356/4794-
dc.description.abstractThis thesis presents our findings on Cu diffusion into different potential barrier layers.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials-
dc.titleStudy of copper diffusion in tantalum based barrier materialsen_US
dc.typeThesisen_US
dc.contributor.supervisorZhang, Dao Huaen_US
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.description.degreeDoctor of Philosophy (EEE)en_US
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Appears in Collections:EEE Theses
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