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Title: Electrochemical plated copper for interconnect applications
Authors: Loh, Stephen Soon Ann.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
Issue Date: 2004
Abstract: Obtain a fundamental understanding of the interactions between the organic additives and their effects on mechanism of the plating process. Study the effects of current density (both DC and pulsed waveform) on the properties of Cu films electroplated from baths with different additives. Study the effects of substrate on the properties of the electroplated Cu films.
Schools: School of Electrical and Electronic Engineering 
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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