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Title: Electrical design, modelling and optimization of a low-cost wafer level chip scale package (WL-CSP)
Authors: Low, Hong Guan.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Issue Date: 2003
Abstract: This report presented the design of a Wafer Level Chip-Scale Package (WL-CSP) using a patented UTAC’s Build Up (UBU) technology, which is a low-cost packaging process with a redistribution layer. From various papers, it had been shown that WL-CSP has superior electrical performance over conventional and advanced packages.
Schools: School of Electrical and Electronic Engineering 
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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