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https://hdl.handle.net/10356/4979
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DC Field | Value | Language |
---|---|---|
dc.contributor.author | Chai, Koh Chin | en_US |
dc.date.accessioned | 2008-09-17T10:02:37Z | - |
dc.date.available | 2008-09-17T10:02:37Z | - |
dc.date.copyright | 2005 | en_US |
dc.date.issued | 2005 | - |
dc.identifier.uri | http://hdl.handle.net/10356/4979 | - |
dc.description.abstract | The objective of this project is to resolve defect density issues of the Novellus Photo Resist Strip to reduce wafer scrape and improve yield for Chartered Silicon Partners, Fab 6, CHRT. The engineers will be able to use the resolution of the findings and implement across all Novellus Photo Resist Strippers. This includes identifying root cause of the problem, current design limitations, area of improvement, feasibility of new designs and implementation of new design and control method of the new design. | en_US |
dc.rights | Nanyang Technological University | en_US |
dc.subject | DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging | - |
dc.title | Particle reduction of novellus PEP3510 photo resist stripper | en_US |
dc.type | Thesis | en_US |
dc.contributor.supervisor | Ahn Jaeshin | en_US |
dc.contributor.school | School of Electrical and Electronic Engineering | en_US |
dc.description.degree | Master of Science (Microelectronics) | en_US |
item.fulltext | With Fulltext | - |
item.grantfulltext | restricted | - |
Appears in Collections: | EEE Theses |
Files in This Item:
File | Description | Size | Format | |
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EEE-THESES_96.pdf Restricted Access | 17.82 MB | Adobe PDF | View/Open |
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