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https://hdl.handle.net/10356/49884
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DC Field | Value | Language |
---|---|---|
dc.contributor.author | Liu, Yanan | |
dc.date.accessioned | 2012-05-25T04:16:07Z | |
dc.date.available | 2012-05-25T04:16:07Z | |
dc.date.copyright | 2012 | en_US |
dc.date.issued | 2012 | |
dc.identifier.uri | http://hdl.handle.net/10356/49884 | |
dc.description.abstract | Polymer has high flexibility and high elasticity, which make it a potential choice for applications such as packaging. However the applications are limited by low thermal and electrical conductivities of polymer. Addictive fillers can be introduced to increase the mechanical, electrical and thermal properties of polymer. Carbon nanotubes possess excellent mechanical, electrical, and thermal properties that make nanotubes excellent candidates to fabricate multifunctional polymer nano-composites. These CNT and polymer composites are promising for specific applications such as electronic packaging and thermal dissipating. Therefore, firstly, it is important to conduct a parametric study of CNT growth. Secondly, integration approaches of CNT into polymers and improvements that CNTs could bring in should be understood. | en_US |
dc.format.extent | 77 p. | en_US |
dc.language.iso | en | en_US |
dc.rights | Nanyang Technological University | |
dc.subject | DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials | en_US |
dc.title | Characterization on PECVD growth of MWCNTs, and its application in polymer composites | en_US |
dc.type | Final Year Project (FYP) | en_US |
dc.contributor.supervisor | Tay Beng Kang | en_US |
dc.contributor.school | School of Electrical and Electronic Engineering | en_US |
dc.description.degree | Bachelor of Engineering | en_US |
item.grantfulltext | restricted | - |
item.fulltext | With Fulltext | - |
Appears in Collections: | EEE Student Reports (FYP/IA/PA/PI) |
Files in This Item:
File | Description | Size | Format | |
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EEEA6112-111.pdf Restricted Access | FYP report main article | 3.62 MB | Adobe PDF | View/Open |
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