Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/4991
Title: Characterization and modeling of on-chip interconnects for silicon RFIC design
Authors: Ong, Beng Hwee
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Issue Date: 2005
Source: Ong, B. H. (2005). Characterization and modeling of on-chip interconnects for silicon RFIC design. Master’s thesis, Nanyang Technological University, Singapore.
Abstract: The characterization and modelling of on-chip interconnects had been carried out in this project. First, an overview of the on-chip interconnect on lossy silicon-based process is presented. Second, on-wafer high frequency measurements of the on-chip interconnects are carried out and investigated in depth.
URI: https://hdl.handle.net/10356/4991
DOI: 10.32657/10356/4991
Rights: Nanyang Technological University
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

Files in This Item:
File Description SizeFormat 
EEE-THESES_970.pdf1.35 MBAdobe PDFThumbnail
View/Open

Page view(s) 50

350
Updated on Oct 15, 2021

Download(s) 20

193
Updated on Oct 15, 2021

Google ScholarTM

Check

Altmetric


Plumx

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.