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|Title:||Scanning methodology||Authors:||Ong, Lay Ting.||Keywords:||DRNTU::Engineering::Electrical and electronic engineering::Electronic systems||Issue Date:||2004||Abstract:||Illustrate the various sampling strategy used in different phase of a product cycle, comparing two types of inspection tools and presenting three case studies to illustrate the importance of early detection. The impact of defects towards wafer yield will also be addressed.||URI:||http://hdl.handle.net/10356/5004||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||EEE Theses|
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