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Title: Scanning methodology
Authors: Ong, Lay Ting.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Electronic systems
Issue Date: 2004
Abstract: Illustrate the various sampling strategy used in different phase of a product cycle, comparing two types of inspection tools and presenting three case studies to illustrate the importance of early detection. The impact of defects towards wafer yield will also be addressed.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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