Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/50340
Title: Bonding of micro devices
Authors: Peh, Chow Keong.
Keywords: DRNTU::Engineering::Mechanical engineering
Issue Date: 2012
Abstract: In recent years, bonding device has evolved from small application such as toys to big application such as cars. Materials to be used has been changed from glass in the past to current thermoplastic such as Poly(methyl Methacrylate) PMMA for its durability and other characteristic.
URI: http://hdl.handle.net/10356/50340
Schools: School of Mechanical and Aerospace Engineering 
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)

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