Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5050
Title: Application of chemical mechanical polishing for sub-micron semiconductor device fabrication
Authors: Goh, Hua Kooi.
Keywords: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
Issue Date: 2001
Abstract: This project investigated the process parameters, polishing consumables and pattern density dependencies in shallow trench isolation process performance.
URI: http://hdl.handle.net/10356/5050
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Theses

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