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https://hdl.handle.net/10356/5050| Title: | Application of chemical mechanical polishing for sub-micron semiconductor device fabrication | Authors: | Goh, Hua Kooi. | Keywords: | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials | Issue Date: | 2001 | Abstract: | This project investigated the process parameters, polishing consumables and pattern density dependencies in shallow trench isolation process performance. | URI: | http://hdl.handle.net/10356/5050 | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MSE Theses |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| MSE-THESES_16.pdf Restricted Access | 5.47 MB | Adobe PDF | View/Open |
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