Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5052
Title: Study of the interfaces between electroless nickel under bump metallization and lead-free solders
Authors: He, Min.
Keywords: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Issue Date: 2004
Abstract: This work focuses on the interfacial reaction between Sn-bearing solders (lead-free Sn-3.5Ag and eutectic Sn-37Pb) and Ni-based UBMs (electrolessly plated Ni-P and sputtered Ni) in terms of morphology and growth kinetics of the intermetallic compound. Effect of interfacial reaction on the mechanical strength of the solder joints has been studied using a tensile test. Comparison of these solder/UBM systems is made in order to obtain a systematic and comprehensive understanding of the interaction in reflow and thermal aging processes. There are three separate but interrelated sub-topics in the present experimental investigation.
URI: http://hdl.handle.net/10356/5052
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
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