Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5064
Title: Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength
Authors: Kithva Prakash Hariram.
Keywords: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Issue Date: 2003
Abstract: This work details the effect of Lead, a heavy metal toxin, on the interfacial reaction between Cu and Sn-Pb solders and the tensile fracture of solder joints.
URI: http://hdl.handle.net/10356/5064
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Theses

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