Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5064
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dc.contributor.authorKithva Prakash Hariram.en_US
dc.date.accessioned2008-09-17T10:18:59Z-
dc.date.available2008-09-17T10:18:59Z-
dc.date.copyright2003en_US
dc.date.issued2003-
dc.identifier.urihttp://hdl.handle.net/10356/5064-
dc.description.abstractThis work details the effect of Lead, a heavy metal toxin, on the interfacial reaction between Cu and Sn-Pb solders and the tensile fracture of solder joints.en_US
dc.format.extent216 p.-
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects-
dc.titleIntermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strengthen_US
dc.typeThesisen_US
dc.contributor.supervisorSritharan, Thirumanyen_US
dc.contributor.schoolSchool of Materials Science & Engineeringen_US
dc.description.degreeDoctor of Philosophy (SME)en_US
item.grantfulltextrestricted-
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