Please use this identifier to cite or link to this item:
https://hdl.handle.net/10356/5064| Title: | Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength | Authors: | Kithva Prakash Hariram. | Keywords: | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects | Issue Date: | 2003 | Abstract: | This work details the effect of Lead, a heavy metal toxin, on the interfacial reaction between Cu and Sn-Pb solders and the tensile fracture of solder joints. | URI: | http://hdl.handle.net/10356/5064 | Schools: | School of Materials Science & Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MSE Theses |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| MSE-THESES_29.pdf Restricted Access | 13.21 MB | Adobe PDF | View/Open |
Page view(s) 50
591
Updated on Apr 24, 2025
Download(s)
7
Updated on Apr 24, 2025
Google ScholarTM
Check
Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.