Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5067
Title: Electroplating of copper metallization of sub-micron integrated circuits
Authors: Law, Shao Beng.
Keywords: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Issue Date: 2001
Abstract: In this project, plating in electrolytes with and without additives was evaluated. The impact of these electrolytes and various plating parameters such as current density, current pulse waveforms, wafer rotation on the characteristics of the plated Cu film were studied.
URI: http://hdl.handle.net/10356/5067
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Theses

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