Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment
Date of Issue2005
School of Materials Engineering
The global objective of this research endeavor is to inhibit the excessive growth of IMC and improve the properties of Sn-Ag-Cu lead-free solder alloy by adding small mount of Sb.
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Nanyang Technological University