Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5076
Title: Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment
Authors: Chen, Binling
Keywords: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Issue Date: 2005
Source: Chen, B. (2005). Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment. Doctoral thesis, Nanyang Technological University, Singapore.
Abstract: The global objective of this research endeavor is to inhibit the excessive growth of IMC and improve the properties of Sn-Ag-Cu lead-free solder alloy by adding small mount of Sb.
URI: https://hdl.handle.net/10356/5076
DOI: 10.32657/10356/5076
Rights: Nanyang Technological University
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MSE Theses

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