Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5077
Title: Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices
Authors: Lim, Boon Kiat.
Keywords: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Issue Date: 2004
Abstract: Since the advent of microelectronics and wafer fabrication, the need for diffusion barriers/adhesion promoters in interconnect systems to enhance mechanical stability and prevent interdiffusion has emerged. This studey investigated the integrity of TiN diffusion barriers in A1 interconnect system.
URI: http://hdl.handle.net/10356/5077
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Theses

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