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|Title:||Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices||Authors:||Lim, Boon Kiat.||Keywords:||DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects||Issue Date:||2004||Abstract:||Since the advent of microelectronics and wafer fabrication, the need for diffusion barriers/adhesion promoters in interconnect systems to enhance mechanical stability and prevent interdiffusion has emerged. This studey investigated the integrity of TiN diffusion barriers in A1 interconnect system.||URI:||http://hdl.handle.net/10356/5077||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MSE Theses|
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